
The rise of artificial intelligence — particularly large language models (LLMs) and edge AI applications — has created unprecedented demands on IC design and engineering services.
According to Bloomberg Intelligence’s “AI fuels $24 billion chip design market,” the EDA market supporting IC design is projected to reach USD 23.9 billion by 2030 with a CAGR of 11.8%.
TrendForce further notes that as cloud service providers (CSPs) invest in custom ASICs for AI processing, traditional IC designers are expanding from logic design into packaging/chiplets and system-level performance optimization.
This demonstrates that:
AI chip design is not merely about increasing transistor count or shrinking nodes — it requires integrating technologies such as 3D packaging, silicon photonics (SiPh), high-bandwidth memory (HBM), and architectures optimized for inference and training.
AI-enhanced EDA tools boost productivity, shorten design cycles, and improve PPA — making them key competitive assets for AI chip development.
Recommendations for Businesses and Legal Advisors
Designing AI chips (often custom ASICs or accelerators) demands explicit contract terms covering IP rights, packaging responsibilities, and design confidentiality due to high complexity and costs.
Engineers and design service providers should continuously update their expertise in AI-driven EDA tools, packaging, and chiplet technologies.
Given the strategic importance of this sector, both enterprises and governments should develop clear roadmaps for AI-oriented IC design ecosystems — not merely focus on chip manufacturing.
AI IC design and AI-powered EDA tools form a mutually reinforcing cycle: the more AI chips are designed, the better tools become — and the more skilled designers are needed. This is one of the most strategic domains for design companies and advisory organizations to focus on in the coming years.
Sources:
“AI fuels $24 billion chip design market,” Bloomberg Intelligence, Feb 4 2025.
“CSPs’ ASIC Push Sparks Competition Among IC Designers, Margins Under Pressure,” TrendForce, Nov 3 2025.
“NVIDIA Unveils Future AI Accelerators Design featuring Silicon Photonics,” TrendForce, Dec 11 2024.